Skip to main content
Breaking the Performance Wall: Why Interconnects Are Moving Closer to the Chip

Breaking the Performance Wall: Why Interconnects Are Moving Closer to the Chip

Surging demands from AI are creating a performance wall, driving a migration in system design toward the chip substrate. Mastering the physical proximity of interconnections has become a central focus for increasing system speed and power efficiency.

Discover Chip-Level Connectivity

Common Searches

We believe in the transformative power of creating connections. Around the world and across industries, Molex is enabling next-generation technology for data centers, vehicles, industrial environments, medical technology, consumer devices and more. Alongside our customers, we are building collaborative synergies that drive innovation forward.

Together, we are Creating Connections for Life

Customer Success Stories

The world’s most innovative brands have come to depend on us for collaborative innovation, quality, reliability, and responsiveness.

Learn How
Customer Success Stories

Customer Success Stories

The world’s most innovative brands have come to depend on us for collaborative innovation, quality, reliability, and responsiveness.

Learn How

Impress Co-Packaged Copper (CPC) Solution

Engineered to provide ultra high-speed data transmission for next-generation data centers, the Impress Co-Packaged Copper Solution includes a compression-based substrate connector and mating cable assembly that support data rates of 224Gbps PAM-4 and beyond.

Protect the Substrate Surface
Impress Co-Packaged Copper (CPC) Solution